Design Rule Check - PCB1.drc 8.8 KB

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  1. Protel Design System Design Rule Check
  2. PCB File : D:\Altium\bip_Project\PCB1.PcbDoc
  3. Date : 10/6/2024
  4. Time : 3:24:52 PM
  5. Processing Rule : Clearance Constraint (Gap=0.2mm) (All),(All)
  6. Violation between Clearance Constraint: (Collision < 0.2mm) Between Pad Q2-1(40.073mm,9.331mm) on Multi-Layer And Pad Q2-2(38.803mm,9.458mm) on Multi-Layer
  7. Violation between Clearance Constraint: (0.188mm < 0.2mm) Between Pad Q2-1(40.073mm,9.331mm) on Multi-Layer And Track (38.803mm,9.458mm)(38.803mm,9.883mm) on Bottom Layer
  8. Violation between Clearance Constraint: (Collision < 0.2mm) Between Pad Q2-2(38.803mm,9.458mm) on Multi-Layer And Pad Q2-3(37.533mm,9.331mm) on Multi-Layer
  9. Violation between Clearance Constraint: (0.188mm < 0.2mm) Between Pad Q2-2(38.803mm,9.458mm) on Multi-Layer And Track (35.567mm,7.366mm)(37.533mm,9.331mm) on Bottom Layer
  10. Violation between Clearance Constraint: (0.188mm < 0.2mm) Between Pad Q2-2(38.803mm,9.458mm) on Multi-Layer And Track (40.073mm,7.044mm)(40.073mm,9.331mm) on Bottom Layer
  11. Violation between Clearance Constraint: (0.188mm < 0.2mm) Between Pad Q2-3(37.533mm,9.331mm) on Multi-Layer And Track (38.803mm,9.458mm)(38.803mm,9.883mm) on Bottom Layer
  12. Violation between Clearance Constraint: (Collision < 0.2mm) Between Pad Q4-1(40.073mm,16.329mm) on Multi-Layer And Pad Q4-2(38.803mm,16.456mm) on Multi-Layer
  13. Violation between Clearance Constraint: (0.188mm < 0.2mm) Between Pad Q4-1(40.073mm,16.329mm) on Multi-Layer And Track (36.209mm,19.05mm)(38.803mm,16.456mm) on Top Layer
  14. Violation between Clearance Constraint: (Collision < 0.2mm) Between Pad Q4-2(38.803mm,16.456mm) on Multi-Layer And Pad Q4-3(37.533mm,16.329mm) on Multi-Layer
  15. Violation between Clearance Constraint: (0.188mm < 0.2mm) Between Pad Q4-2(38.803mm,16.456mm) on Multi-Layer And Track (34.163mm,19.699mm)(37.533mm,16.329mm) on Top Layer
  16. Violation between Clearance Constraint: (Collision < 0.2mm) Between Pad Q4-3(37.533mm,16.329mm) on Multi-Layer And Track (36.209mm,19.05mm)(38.803mm,16.456mm) on Top Layer
  17. Rule Violations :11
  18. Processing Rule : Short-Circuit Constraint (Allowed=No) (All),(All)
  19. Violation between Short-Circuit Constraint: Between Pad Q2-1(40.073mm,9.331mm) on Multi-Layer And Pad Q2-2(38.803mm,9.458mm) on Multi-Layer Location : [X = 64.888mm][Y = 34.744mm]
  20. Violation between Short-Circuit Constraint: Between Pad Q2-2(38.803mm,9.458mm) on Multi-Layer And Pad Q2-3(37.533mm,9.331mm) on Multi-Layer Location : [X = 63.618mm][Y = 34.744mm]
  21. Violation between Short-Circuit Constraint: Between Pad Q4-1(40.073mm,16.329mm) on Multi-Layer And Pad Q4-2(38.803mm,16.456mm) on Multi-Layer Location : [X = 64.888mm][Y = 41.742mm]
  22. Violation between Short-Circuit Constraint: Between Pad Q4-2(38.803mm,16.456mm) on Multi-Layer And Pad Q4-3(37.533mm,16.329mm) on Multi-Layer Location : [X = 63.618mm][Y = 41.742mm]
  23. Violation between Short-Circuit Constraint: Between Pad Q4-3(37.533mm,16.329mm) on Multi-Layer And Track (36.209mm,19.05mm)(38.803mm,16.456mm) on Top Layer Location : [X = 63.504mm][Y = 42.199mm]
  24. Rule Violations :5
  25. Processing Rule : Un-Routed Net Constraint ( (All) )
  26. Rule Violations :0
  27. Processing Rule : Modified Polygon (Allow modified: No), (Allow shelved: No)
  28. Rule Violations :0
  29. Processing Rule : Width Constraint (Min=0.3mm) (Max=0.8mm) (Preferred=0.5mm) (All)
  30. Rule Violations :0
  31. Processing Rule : Width Constraint (Min=0.5mm) (Max=1.6mm) (Preferred=1.2mm) (InNet('GND'))
  32. Rule Violations :0
  33. Processing Rule : Width Constraint (Min=0.5mm) (Max=2mm) (Preferred=1.5mm) (InNet('+24'))
  34. Rule Violations :0
  35. Processing Rule : Routing Topology Rule(Topology=Shortest) (All)
  36. Rule Violations :0
  37. Processing Rule : Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All)
  38. Rule Violations :0
  39. Processing Rule : Hole Size Constraint (Min=0.2mm) (Max=2.54mm) (All)
  40. Violation between Hole Size Constraint: (4.115mm > 2.54mm) Pad Q1-C(57.099mm,35.611mm) on Multi-Layer Actual Hole Size = 4.115mm
  41. Violation between Hole Size Constraint: (4.115mm > 2.54mm) Pad Q1-C/(57.099mm,5.385mm) on Multi-Layer Actual Hole Size = 4.115mm
  42. Rule Violations :2
  43. Processing Rule : Hole To Hole Clearance (Gap=0.254mm) (All),(All)
  44. Rule Violations :0
  45. Processing Rule : Minimum Solder Mask Sliver (Gap=0.001mm) (All),(All)
  46. Rule Violations :0
  47. Processing Rule : Silk To Solder Mask (Clearance=0.001mm) (IsPad),(All)
  48. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Arc (38.811mm,2.337mm) on Top Overlay And Pad Q3-C(41.351mm,2.337mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0mm]
  49. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Arc (38.811mm,2.337mm) on Top Overlay And Pad Q3-E(36.271mm,2.337mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0mm]
  50. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Arc (38.811mm,2.337mm) on Top Overlay And Pad Q3-E(36.271mm,2.337mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0mm]
  51. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Arc (38.812mm,2.337mm) on Top Overlay And Pad Q3-C(41.351mm,2.337mm) on Multi-Layer [Top Overlay] to [Top Solder] clearance [0mm]
  52. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad D4-A(92.532mm,1.702mm) on Multi-Layer And Track (92.532mm,1.487mm)(92.532mm,5.457mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  53. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad D4-C(92.532mm,17.831mm) on Multi-Layer And Track (92.532mm,14.457mm)(92.532mm,18.427mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  54. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad D5-A(2.997mm,21.641mm) on Multi-Layer And Track (2.997mm,21.426mm)(2.997mm,25.396mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  55. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad D5-C(2.997mm,37.77mm) on Multi-Layer And Text "D5" (4.064mm,38.862mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  56. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad D5-C(2.997mm,37.77mm) on Multi-Layer And Track (2.997mm,34.396mm)(2.997mm,38.366mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  57. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad D6-A(10.49mm,37.77mm) on Multi-Layer And Track (10.49mm,34.015mm)(10.49mm,37.985mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  58. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad D6-C(10.49mm,21.641mm) on Multi-Layer And Track (10.49mm,21.045mm)(10.49mm,25.015mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  59. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad R4-1(87.307mm,7.937mm) on Multi-Layer And Track (85.402mm,7.937mm)(86.672mm,7.937mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  60. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad R4-2(75.115mm,7.81mm) on Multi-Layer And Track (76.106mm,7.835mm)(77.071mm,7.835mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  61. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad R5-1(87.307mm,2.596mm) on Multi-Layer And Track (85.402mm,2.596mm)(86.672mm,2.596mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  62. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad R5-2(75.115mm,2.469mm) on Multi-Layer And Track (76.106mm,2.494mm)(77.071mm,2.494mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  63. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad R6-1(86.817mm,13.278mm) on Multi-Layer And Track (84.912mm,13.278mm)(86.182mm,13.278mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  64. Violation between Silk To Solder Mask Clearance Constraint: (Collision < 0.001mm) Between Pad R6-2(74.625mm,13.151mm) on Multi-Layer And Track (75.616mm,13.176mm)(76.581mm,13.176mm) on Top Overlay [Top Overlay] to [Top Solder] clearance [0mm]
  65. Rule Violations :17
  66. Processing Rule : Silk to Silk (Clearance=0.01mm) (All),(All)
  67. Violation between Silk To Silk Clearance Constraint: (Collision < 0.01mm) Between Region (0 hole(s)) Top Overlay And Text "P1" (6.096mm,11.659mm) on Top Overlay Silk Text to Silk Clearance [0mm]
  68. Rule Violations :1
  69. Processing Rule : Net Antennae (Tolerance=0mm) (All)
  70. Rule Violations :0
  71. Processing Rule : Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All)
  72. Rule Violations :0
  73. Violations Detected : 36
  74. Waived Violations : 0
  75. Time Elapsed : 00:00:00